Engineering Capabilities
Signal Integrity, Inc. is an engineering company. Executing a complex socket design project that operates the first time & on time to your specification is the result of experience, focus, investment, collaboration, and an engineering process that is a resource for your semiconductor test development teams. Our engineers work to deliver continuous product improvements and interconnect solutions that work, enhancing your ATE test cells, and lab and system test infrastructure.
Engineering Process
01
Experience
We leverage several years of semiconductor test, ATE design, spring probe development, and high-volume manufacturing solutions in your custom test socket solutions. We can drive to the lowest cost per insertion because we know how things work at a fundamental level. No guessing, and no seat-of-the-pants proposals. Only data-driven solutions.
02
Engineering Tools
Our engineering flow – from design & manufacturing through QC release to shipment – uses the latest software tools. Each project can generate 3D models, perform electrical and mechanical simulations, test for stress and force by finite element analysis, and verify thermal limits through simulation. We use Solidworks™, Ansys Electronic Desktop Suite, thermal simulation in Solidworks™ and Ansys IcePAK™, Cadence and Altium PCB layout software, and AutoCAD to engineer your test contact solutions.
03
Verification
Internal testing and independent labs evaluate our probe and socket design specifications. Lifetime testing, reliability testing, and new IP physical testing ensures engineering meets reality.
04
Extensive Design Library
With hundreds of socket designs, thousands of probe application components, and years of test cell, handler interface, test program and ATE design experience, we are confident we can engineer any new socket design challenge.
05
Spring Probe Contact Development
We have our own proprietary contact probe catalog that has earned thousands of design wins in all major semiconductor test facilities. We use OEM probes exclusively in our socket designs. The benefit from 25+ years of continuous engineering work goes directly into your socket solutions.
06
Collaboration Tools
Throughout the design, we share an encrypted secure project folder with your team, allowing us to collaborate seamlessly on a 24 hour design cycle. Open project delivery dates are tracked through the project delivery.
Callouts
- Capture the Device Package Specification
- Capture the Test Specification
- Choose the right probe to meet the application
- Choose the right material
- Collaborate to finalize design for fabrication
- Design for Manufacturing
- Delivery inside 6 weeks ARO and design approval
Case Study
TEST SOCKET FOR A LARGE PIN COUNT ASIC SWITCH CHIP USING HYBRID POWER AND TUNED HIGH FREQUENCY BROADBAND SIGNAL PROBES
The Challenge: Deliver a large pin count (>750 pin) test socket for a grid array device at 0.8mm pitch. Lower the cost and improve the operating bandwidth of the socket.
The target operating frequency for the high speed IO macros has to meet PCI Gen5 specifications. The target Nyquist is 26GHz at -0.75dB maximum insertion loss, and a -17dB return loss through the Nyquist frequency. The target IO impedance is 85 ohms with an upper limit of 90 ohms. The IO macro power maximum is 1.5 amps per pin continuous. The core IO power is 400W with a maximum of 6 amps continuous current per pin on the core. The IO uses PAM4 signaling so the socket could not contribute any deterministic jitter. The IO signal probes are impedance matched to 100 ohms at 0.8mm pitch and are designed for zero reflective stubs.
The Solution: We engineered these custom tuned probes to address the application specific requirements for the IO macros in your large ASIC devices. This test socket exceeds PCIe GEN5 performance with very high power delivery. There is no need for coaxial probe structures. Crosstalk is less than -45dB based on the package layout. This socket design solution is scalable for AI, Server, big data, graphics, and FPGA test sockets.
The probes were engineered with the hardest precious metal alloy plungers, clad barrels, and optimized diameters and probe lengths. Precision design for manufacturing ensured part alignment, first pass yield, and an exact fit to your handler kits.
Our probes and socket materials worked to provide maximum reliability, and the lowest cost per insertion. “Poka-yoke” design techniques feature ease of maintenance and minimum down time at your test facility.
To read more, download the complete white paper.