Design
Capabilities
Signal Integrity engineers are experts at converting your semiconductor and system test requirements to application specific test socket and system test interconnect products.
Design Advantages with Signal Integrity
Engaging with SI on your socket or contact assembly project starts with our design engineers creating a working proposal document folder. Upfront, the design is rendered to get the 2D and 3D drawings delivered quickly to your team to review and start the collaboration work to meet your needs.
We identify the tough challenges and critical specifications before we engage commercially and properly price the project upfront.
01
Mechanical Design and Simulation
Solidworks™, AutoCAD™, Solidworks™ Mechanical Simulation and 3D rendering speed your design proposals through to release and delivery.
02
Probe Component Design
We have established a deep well of expertise when it comes to probe material selection, metallurgic properties of contact force, plating development, proprietary contact designs, and custom contact structures and spring development.
03
Off the Shelf & custom Designs
We design both off the shelf SII OEM spring probe solutions from stock as well as custom probes to fit your high insertion life contact applications.
04
Design with the Right Engineering Plastics
The design phase also requires proper selection of the engineering plastics material used in the socket and contactor components. The quality of guide plate precision, the nature and precision of the alignment structures, the probe placement and contact accuracy, and the contact radius precision are just a few of the specifications that derive from the choice of the engineering plastic. Our experience with these materials means the correct choice early in the design.
05
Design for High Power
We specialize in providing the highest continuous operating current in the smallest probe footprint. Our designs in this space require thermal simulation, process engineering design, and a willingness to take on the challenge of high power in very small packages. Our power block designs lead the way in Si-C, IGBT, and smart power management IC testing.
06
Design for High Frequency Testing
Our design library contains probe structures that are tuned to operate up to 70 GHz within a 5% impedance window. We design within the mechanical, PCB, and the device package limitations to deliver the highest operating frequency possible.
Callouts
- Capture the customer’s specification
- Generate a 3D Proposal
- Engage on design challenges
- Simulate, and re-simulate