Technical
Library

SIGNAL INTEGRITY INC SII Socket Handbook

This document is intended as an introductory for engineers who want to learn more about contact assemblies used for semiconductor test. Covered in this handbook is a detailed description how spring probe sockets work, what types of spring probes best match your application requirements, and how to interpret spring probe specifications to understand better what risks and tradeoffs are entailed in designing a reliable, cost-effective test connector solution. Download this Application Note and Maintenance Manual for the SII Test Socket Family from Signal Integrity Inc.

A1562 Kelvin Contact Specifications

This document details the mechanical, electrical, and thermal specifications for the A1562 Kelvin Contact by Signal Integrity, Inc.. Engineered for full Kelvin contact and 4-wire measurements at a 0.4 mm pitch, the probe is designed for high-accuracy DC, ADC, and mixed-signal measurement applications.

AA945 PCIExpress Gen5 and Gen6 Fine Pitch Spring Probe Socket

This document details the specifications for our fine pitch broadband socket probe, the AA945. Optimized for 0.4 and 0.5mm pitch devices, this probe is the base technology used in implementing socket designs for ASICs with large pin counts that operate to 2A continuous currents and up to 33GHz Nyquist frequencies.

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Basic Socket Cleaning Instructions

Basic Socket Cleaning Instructions Abstract Information

AA945 PCIe Gen 6 High-Fidelity Probe Data

Detailed performance characterization including insertion loss, return loss, and impedance profiles up to 60 GHz. Available for verified Signal Integrity engineers. Active NDA required.

Signal Integrity High Pin Count Array Socket Testing

Testing large pin count grid array packages (2,000+ pins, up to 55×55 mm, at 0.8–1.0 mm pitch) presents a unique set of mechanical, electrical, and materials challenges that can undermine first-pass yield and drive up cost of test. This application note identifies the five most common issues test engineers face with these devices and describes practical solutions grounded in probe selection, socket design, and contact material science.

High-Bandwidth Test Contact Solutions for 0.5mm Pitch

As wireless protocols, RF front-ends, and mixed-signal SoCs push operating frequencies well past 10 GHz range, as the power constraints in small packages reach 10s of amps of continuous current and the test interface between the device and ATE becomes more critical link to keep the supply chain stocked with these critical semiconductors, the need for high reliability and broad application support is critical. With high functionality ICs delivered at 0.5 mm pitch and below, test contactors are challenged to not introduce unacceptable insertion loss, impedance discontinuities, or crosstalk that can mask device performance or create false failures. At the same time these contactors and sockets need to deliver currents exceeding 5A per power pad. This application note introduces sockets that use Signal Integrity Inc.’s family of 0.5 mm pitch spring probes engineered to deliver transparent, high-bandwidth test channels for RF, wireless, and high-speed digital devices while delivering the power to address high current power management applications.

Ultra-Fine Pitch Test Socket Solutions. Contact Technology for the Most Demanding Applications

As semiconductor devices shrink to ever-smaller packages with pad pitches at 0.3 mm and below, test engineers face a dual challenge: maintaining signal fidelity at frequencies reaching into the millimeter-wave range while making reliable mechanical contact on pads as small as 0.15 mm in diameter and dealing with higher currents and the need for very precise DC measurements. This application note describes a family of 0.3 pitch spring probes that deliver up to 40+ GHz of bandwidth in an ultra-compact form factor, purpose-built for the most demanding fine-pitch production test and strip test applications.