High-Current & Kelvin Sockets
Precision measurement at 400 Amps. No overheating. No compromise. From tiny PMICs requiring precise Kelvin (Force/Sense) measurements to massive IGBT modules pushing 400 Amps, our custom high current test sockets solve the ‘Heat vs. Accuracy’ conflict. By combining solid precious metal plungers with thermally optimized housings, we deliver ultra-low contact resistance (<10mΩ) and superior heat dissipation for automotive, GaN, and mobile power applications.
HIGH-CURRENT & PRECISION KELVIN CONFIGURATIONS
Reliable power delivery requires demands a thermally balanced interconnect with the quality materials needed for low thermal losses. Our power socket architectures utilize solid precious metal plungers, integrated plated Cu thermal slugs, and isolated force/sense channels to 0.25mm pitch to help eliminate resistance drift, resistive losses and increased thermal mass to delay overheating. Browse our primary Power & Kelvin configurations below to find the ideal match for your PMIC, SiC, GaN, or IGBT applications.
| Configuration | Current (Continuous) | Contact Resistance | Min Pitch | Temp Range | Best For Applications |
|---|---|---|---|---|---|
| Kelvin (Force/Sense) | 3.0 A / pin | < 15 mΩ (Stable) | 0.25 mm | -55°C to +180°C | PMIC, RDSon Measurement, Battery Mgmt, DC_DC Conversion, Regulators and Power Switching |
| High Current Pulse and Continuous | > 1.2kVA pulsed power | < 5 mΩ | 0.40 mm | -55°C to +200°C | IGBT, GaN, SiC, Automotive, EV, Charging |
| Fine Pitch Power | 1.5 A / pin | 25 mΩ | 0.20 mm | Standard | Mobile APU, Wearables, High Density BGA |
| Production Power | 50 A (Pulsed) | Low Wear Alloy | 0.40 mm | Tri-Temp | HVM Strip Test, Gravity Feed Handlers |
Overview
KEY FEATURES OF OUR HIGH CURRENT TEST SOCKETS
- True Kelvin at 0.4mm Pitch: Our proprietary probe designs allow for isolated Force and Sense contacts on a single pad down to 0.4mm pitch, enabling precise RDSon measurements on tiny WLCSP devices.
- Proper BGA Kelvin HVM Test: Our proprietary Kelvin BGA Test probe plungers enable 3-point contact per probe, without damaging BGA balls and allowing for automatic cleaning in HVM.
- Thermal Management: We integrate heat sinks, air channels, and thermal slugs directly into the socket lid and base to dissipate heat during high-current testing, preventing damage to the socket and board and lowering the chance of device throttling.
- Solid Plunger Technology: Unlike plated probes that burn out and go highly resistive, our solid precious metal alloy plungers handle massive current spikes without fusing or degrading.
- Low & Stable Resistance (CRES): Our “4° Arc Scrub” motion cuts through oxides on the device lead, ensuring consistent <10mΩ contact resistance for millions of cycles.
- High-Voltage Safety: Housing materials are selected for high dielectric strength to prevent arcing in high-voltage EV and GaN testing (up to 3kV).
VERIFIED PERFORMANCE & RAPID DELIVERY
Thermal Simulation
We manage the heat.
High current can mean damaging temperatures above 200 deg. C. We perform thermal modeling to ensure your DUT stays cool and your socket doesn’t melt under the high current loads these applications can present.
Made in USA & Singapore
Global Engineering Support
With design and manufacturing in MA and a support hub in Singapore, we support both US design teams and Asian OSAT production floors.
Reliable Delivery
Optimized Supply Chain
We manage logistics locally to minimize bottlenecks. Custom power fixtures are typically deliverable in 6-7 weeks.
GET A FAST & ACCURATE QUOTE
To speed up your simulation and quote process, please have the following ready:
- Device Package Drawing (POD): PDF or DXF format preferred.
- Current Requirements: Specify Continuous Current (Amps) per pin & Total Device Current.
- Thermal Target: What is your operating temperature range? (e.g., -40°C to +150°C).
- Kelvin Requirements: List specific pins that need Force/Sense isolation for precise resistance measurement.
Can you do Kelvin (Force/Sense) on a 0.4mm pitch QFN?
Yes. Our proprietary “Point-to-Point” or “Double-Pin” architectures allow us to land two distinct probes on a single 0.4mm pitch pad, providing accurate 4-wire measurement for RDSon testing.
How do you handle heat dissipation for 100A+ devices?
We design the socket with integrated thermal features, including floating heat slugs, liquid-cooled lids, or high-airflow channels. We also use high-temp housing materials like Torlon/PEEK that won’t deform at 180°C.
What makes your high current test sockets different from standard probes?
We support continuous currents up to 400 Amps for large IGBT modules, and up to 4-10 Amps per pin for standard BGA/QFN packages using our solid plunger probes.