IC TEst
Sockets

01

High Frequency Sockets – RF, SERDES, 5G, Broadband Signals

Signal Integrity, Inc. started their probe business 25 years ago to address the need for high frequency performance in spring probes. High frequency (>10 GHz) sockets and connectors are one of our core engineering skill sets. We can access a large library of probe and probe configurations simulated on HFSS. Since we control the design of the probe contact, we can custom adjust diameters, produce zero stub contact paths, and maintain high compliance in very short contact lengths. The simulation workflow from concept to final tuned design will reach your budgeted  return loss and insertion loss values.

Our high frequency socket solutions do not compromise power delivery. We can deliver  operating continuous currents from 4 to 10 amps per pin.  Our high frequency sockets do not compromise our core HVM insertion goals for pin lifetime, low maintenance, and lowest cost per insertion. Our solutions library and pin design prowess eliminates expensive coaxial probe structures and maintains crosstalk within PCISig and other standards’ specifications.

Test Socket Examples:

• PCIGen5
• PCIGen6
• PCIGen7
• 5G
• Phase Array
• IO Macros
• SERDES Protocol
• Auto Radar
• Substrate Testing and PCISig Compliance

02

Kelvin Contact Sockets

There are many applications that require two probes to contact a single device lead or pad. These devices may demand more current in fine pitch packages. There may be a need for measuring very low turn on resistance for the output stage of a power management device. A device test application may require very accurate voltage or current measurements and need a force sense pin on a single pad to null out the test channel resistance.  Whatever specification drives the need for ultra precise DC measurements, Signal Integrity can provide a force/sense configuration or multiple contact points per pad.

Kelvin Sockets feature:

• Full flexibility for Force/Sense pins anywhere in the array
• Combined High Power/Sense pin pairs
• Two pin contact at 0.4mm pitch within a 0.2mm²  device contact leads, pads or BGA balls.
• 4° arc scrub
• Solid precious alloy for aggressive auto cleaning and consistent contact resistance over the pin lifetime
• Full temperature range – Cryogenic to 180℃.

If you want to know more, check out our Kelvin Contact Application Notes.

03

Large BGA Package, High Pin Count Sockets

Large pin count packages require the most of a socket design. These parts combine very high speed IO macros PCIGen5 or PCIGen6 channels, consume large continuous currents in the core at 4-6 amps per pin, stress the limits of the probes Z-height compliance because of large package planarity issues and the large number of pins requires a probe with very high consistent first touch yield.  The large number of pins in these sockets drives a low cost per insertion per pin for the socket to have a viable ROI. The harsh, abrasive handler environment for these large BGA packages demands a pin with a long active life design.

Our Large Pin Count BGA Socket Features:

• Hybrid, focused probe applications
• High Frequency (50 Ghz), High Power (10A per pin)
• Large compliance inside the performance window – hit those corner pins and center pins under package planarity stress
• Accurate edge or nest alignment features (35 micron variance across the package)
• Long probe life under harsh BGA test conditions using precious metal alloy plungers
• Probe force tuned to match the test cell Z force profile
• Full simulation package provided

04

Power Management IC Sockets

Power management ICs are found in every product market, including consumer and commercial, cell phone, battery management, server power distribution, phased array analog, memory, and database.

These ICs have particular test challenges that Signal Integrity’s sockets address.

1. Small packages-high current. These devices are required to deliver on demand high current under feedback control, often with an on-board MCU.
2. Tight pad pitch. Most of these devices are small in the 5mmx5mm range. The pad-to-pad centers are at 0.4-0.5mm. There are often separate GND and power bus pads and large center pads grouped by function.
3. Force sense may be needed on some or all of the pins.  Very low Drain to Source on resistance (RDS_on) needs precise microvolt measurements. Our Kelvin socket designs work here.
4. Small package-high current means heat needs to be dissipated. Signal Integrity builds thermal mass and cooling air flow features into these sockets to push the very small probe cross sectional diameters up to currents that exceed single pin operating range.

Signal Integrity probe construction for the plungers and clad material used in the barrels are a match for these applications.

05

Handler Test Sockets

Very high volume testing requires sockets that are easy to maintain, and reliable contact over a full operating cycle. Spring probe sockets are maintainable at the individual probe location so socket lifetime is not shortened due to pins breaking or environmental debris clogging the operation. Sockets designed for handler test require precise alignment and careful selection of materials and design choices to maximize socket lifetime.

Our expertise in the details of the fit for the socket height and footprint within the test board layout and handler kit means we can design to any handler setup specification. Cohu MT9510, Seiko Epson pick and place, Hontech 904x, Advantest 4872/4841 pick and place, Cohu Rasco SO1000/2000 gravity feed and Exatron Pick and Place, and Gravity Feed handlers are just some of the high volume test handlers we can be kitted to.

Handler Test Socket Features:

• Long lifetime sockets and probes from SI means lower downtime, higher uptime, less setup time, and less maintenance socket repair.
• We design with the “Poka-yoke” approach for components to ensure maintenance is obvious, parts can’t be swapped, and proper fit is always maintained.
• Small singulated parallel footprints for x36 testing.  Individual sockets can be pulled from the line while the rest can keep running.
• RFID interfacing for tracking material and insertion count
• Kit and PCB Test Board alignment features to fit in 50u tolerance.

06

Strip Test Probe Housings for Die Testing

Signal Integrity supplies probes and fixtures that can operate at 250u pitch, 40 GHz, and 2 amps per pin that focus on the market for strip testing on wafer or singulated die form factors. Our 0.3mm AA series probes are designed for very high volume and very fast cycle time test setups using diagonal or linear strip test fixtures.

Our strip test fixtures are precise. We maintain a 1 deg arc on the pointing accuracy at 0.3mm pitch. We maintain a 35 micron variance and minimize die-to-die contact drift. Strip test fixtures from x2 to x8, for small device dimensions down to 0.3mm pitch, are deliverable in 6-7 weeks.

Strip Test Probe Features:

• Long probe life
• Contact pitch to 0.25mm
• 0.3mm and 0.4mm probe solutions to 40 GHz
• Design for zero probe drift
• X2 to x8 diagonal stripe probe step solutions

07

Engineering and Handtest Sockets

Signal Integrity has a library of unique connection solutions for specialized engineering and hand test sockets. Capabilities in this area include two sided test contacts, integrated flex circuit probe contacts, 0.2mm pitch flex circuit probing, substrate and module test probing, cryogenic design for CTE effects, and non-magnetic test probes.

This market requires direct application support to understand the test requirements and a look toward future technologies and applications, and a desire to address these challenges early in the product cycle.

For marketing and application sockets at very high frequencies, we can participate in the board and contact design using non spring probe technologies, such as elastomer and coplanar waveguide structures.