Custom IC
Test Sockets
Signal Integrity Inc. designs and manufactures custom IC test sockets optimized for the semiconductor industry’s most demanding applications. By leveraging our proprietary spring probe technology, we deliver high-bandwidth (RF/5G), high-current (Kelvin), and fine-pitch solutions with industry-leading cycle life. All engineering and manufacturing is performed in our Massachusetts, USA facility to ensure rapid prototyping and strict quality control.
RF & High Speed
- Bandwidth: >40 GHz (5G/mmWave)
- Impedance: 50Ω Coaxial Design
- Best For: SerDes, PAM4, RF Wireless
Power & Kelvin
- Current: Up to 400 Amps
- Resistance: Ultra-Low (<10mΩ)
- Best For: PMIC, GaN, Automotive
Engineering / Hand Test
- Lid Types: Clamshell, Open Top
- Format: Manual or Semi-Auto
- Best For: Lab Debug, Failure Analysis
BGA & Large Format
- Pin Count: >2,000 I/O Capable
- Packages: BGA, LGA, CGA, Ceramic
- Best For: CPU, GPU, FPGA Testing
QFN & Leadless
- Packages: QFN, MLF, WLCSP, DFN
- Pitch: Down to 0.2mm
- Best For: Mobile, IoT, Consumer
HVM & Strip Test
- Format: Strip, In-Line, Turret
- Life Cycle: >500k Insertions
- Best For: Automated Handlers (ATE)
IC Test Sockets at a Glance
From tiny 4 pin DFN sockets running in high speed gravity feed handlers, to very large BGA arrays in advanced pick and place handlers, to high speed strip test on wafer with millions of cycles, we offer a broad spectrum of IC test socket solutions. Our sockets are found across automotive, telecommunications, RF, aerospace, smart power management, IOT, consumer, and large enterprise package test manufacturing flows. Our sockets ensure the most reliable, accurate long insertion life at the last point of contact in your test channels.
package types:
We address all package types in our IC Test Sockets including:
- Large Array BGA sockets-High Power High Frequency ASICs
- QFN (Quad Flat No Lead)
- Power Quad Flat Package (PQFN)
- Large Ball Grid Array (BGA)
- Full Kelvin Thin Shrink Small Outline Package (TSSOP)
- Small Outline Integrated Circuit (SOIC)
- Plastic Leaded Chip Carrier (PLCC)
- Thin Quad Flat Package (TQFP)
- Quad Flat No-Lead (QFN)
- Land Grid Array (LGA), Organic Substrate Modules
- Dual Flat No-Lead (DFN)
- Micro Leadframe Package (MLP)
- 3 Dimension Wearables
- MEMS
- Custom Medical
- Fine Pitch Flex Circuit
- PCB Module
- Die Strip Test
- Large Power Modules
Key Features
Our IC and MEMS test sockets feature:
- Advanced engineering plastic that fits your application.
- Customizable probe options to fit your unique mechanical constraints.
- Advanced probe and heat sink designs to cover your high current requirements.
- Hybrid RF and power pin solutions to cover your large GPU, Enterprise AI, and FPGA power and bandwidth requirements.
- 24 hour design cycle and manufacturing for fast turn around from design approval.
- Electrical and mechanical post assembly quality and verification.
- Expert test cell support for your OSATs.
Benefits
Engaging with Signal Integrity on your socket designs provide you with:
- Experience and expertise to find the best way to solve your test contactor challenges.
- An engineering driven company with the tools and process management to attend to the details that make our sockets exceed performance requirements.
- The quality and long life of our probe components delivered with the lowest cost per insertion, minimal downtime, and fast turnaround on custom and semi custom solutions.
- The data for seamless interface to your PCB board channel models and PDN simulations, and precision mechanical fit to your existing handler kits as well as 3D step files to help develop your kits.
Key Applications
High Frequency Sockets
Best For: RF, SERDES, 5G, Broadband Signals (>10 GHz)
Signal Integrity, Inc. started their probe business 25 years ago to address the need for high frequency performance in spring probes. High frequency (>10 GHz) sockets and connectors are one of our core engineering skill sets. We can access a large library of probe and probe configurations simulated on HFSS. Since we control the design of the probe contact, we can custom adjust diameters, produce zero stub contact paths, and maintain high compliance in very short contact lengths.
Our high frequency socket solutions do not compromise power delivery (4-10A continuous) or our core HVM insertion goals for pin lifetime. Our pin design prowess eliminates expensive coaxial probe structures and maintains crosstalk within PCISig™ specs.
Applications & Standards
- PCIGen5, PCIGen6, PCIGen7
- 5G & Phased Array
- SERDES Protocol & IO Macros
- Automotive Radar
- Substrate Testing & Compliance
Multi-Protocol FPGA Development Socket
PCI Gen6 Switch Device Test Socket
Optical Hybrid RF Heat Slug Base
Kelvin Contact Sockets
Best For: Precise RDSon measurements, Force/Sense applications
For applications requiring two probes to contact a single device lead or pad. These devices may demand more current in fine pitch packages or require measuring very low turn-on resistance. Whatever specification drives the need for ultra-precise DC measurements, Signal Integrity can provide a force/sense configuration or multiple contact points per pad.
Key Specs & Features
- Flexibility: Force/Sense pins anywhere in the array
- Pitch: Two pin contact at 0.4mm pitch within 0.2mm² area
- Temp Range: Cryogenic to 180℃
- Material: Solid precious alloy for aggressive cleaning
- Design: 4° arc scrub for consistent resistance
Smart Power 90A QFN – sub 2 milliohm RDSon
Substrate Test Socket w/ Kelvin Contacts P0.3MM
Large BGA & High Pin Count
Best For: Enterprise CPU, GPU, and harsh handler environments
Large pin count packages require the most of a socket design. These parts combine very high speed IO macros (PCIGen5/6), consume large continuous currents (4-6A per pin), and stress the limits of Z-height compliance due to package planarity issues. The large number of pins drives the need for a low cost-per-insertion to have a viable ROI.
Key Specs & Features
- Hybrid Design: High Frequency (50 GHz) & High Power (10A)
- Compliance: Hits corner & center pins under planarity stress
- Precision: 35 micron alignment variance
- Durability: Precious metal alloy plungers for long life
- Support: Full simulation package provided
5500 Pin Enterprise CPU Socket
2011L LGA 52.5×51.0MM Custom LLM Processor
2912L BGA 55.0×55.0MM P1.0MM Test Socket
Power Management IC Sockets
Best For: EV Charging, Battery Management, Server Power Distribution
Power management ICs present unique challenges: small packages with high current demands, tight pad pitches, and significant heat dissipation needs. Signal Integrity builds thermal mass and cooling airflow features into these sockets to push small probe diameters to currents that exceed standard ranges.
Technical Solutions
- High Current/Small Package: Optimized thermal mass for heat dissipation.
- Tight Pitch: Supports 0.4-0.5mm pitch with separate GND/Power/Center pads.
- Precision: Kelvin designs for Force/Sense to measure microvolt RDSon.
- Materials: Specialized plunger and clad barrel construction.
IGBT Transistor (for EV charging stations)
190W Integrated Smart Power PCB Module
4kVA Si-C Power FET
Handler Test Sockets
Best For: High Volume Manufacturing (HVM), Automated Lines
High volume testing requires sockets that are easy to maintain with reliable contact over full operating cycles. We design to any handler setup specification including Cohu, Seiko Epson, Hontech, Advantest, and Exatron.
Key Specs & Features
- Uptime: Long lifetime probes reduce maintenance stops.
- Poka-Yoke Design: Parts cannot be swapped or misaligned.
- Parallel Testing: Small footprints for x36 testing (pull one socket while line runs).
- Tracking: RFID interfacing for insertion counts.
- Alignment: Kit and PCB alignment within 50u tolerance.
364L BGA 22.5X15.0X3.6MM P0.50mm Handler Test Socket
8L SOIC 5×6.2MM Handler Test Socket
Strip Test Probe Housings
Best For: Wafer or Singulated Die Testing
Signal Integrity supplies probes and fixtures for strip testing on wafer or singulated die form factors. Our 0.3mm AA series probes are designed for very high volume and very fast cycle time test setups using diagonal or linear strip test fixtures.
Our fixtures are precise, maintaining a 1-degree arc on pointing accuracy at 0.3mm pitch with 35-micron variance to minimize die-to-die drift. Deliverable in 6-7 weeks.
Key Specs & Features
- Performance: Up to 40 GHz and 2 Amps per pin.
- Pitch: Contact pitch down to 0.25mm.
- Stability: Designed for zero probe drift.
- Configuration: X2 to X8 diagonal stripe probe step solutions.
Single Site QFN Probe
39L QFN 8 Sites 2RX4C Strip Test Main ASM
Engineering & Hand Test Sockets
Best For: Lab Debug, Failure Analysis, Rapid Prototyping
Signal Integrity maintains a library of unique connection solutions for specialized engineering and hand test sockets. This market requires direct application support to understand test requirements early in the product cycle.
For very high frequencies, we can also participate in board and contact design using non-spring probe technologies, such as elastomer and coplanar waveguide structures.
Capabilities
- Two-sided test contacts.
- Integrated flex circuit probe contacts (0.2mm pitch).
- Substrate and module test probing.
- Cryogenic design for CTE effects.
- Non-magnetic test probes.
Hand Test Socket
Hand Test Lids
Case Study
Power Management IC Test Socket with Full Kelvin Contacts
The Challenge: A small 3x3mm power management IC was specified for a force sense pin pair on each of the 20 device pads at 0.4mm pitch. Additionally, the device required a 3 amp current through the Vin and GND pad. As a result, this socket was targeted for high volume production at an OSAT so that reliability, simplicity, and robustness was a core target for the design.
The Solution: This solution for a high volume commodity part was cost sensitive, but required a semi-custom solution to fit the two probes to the small pad. Signal Integrity developed a new probe to fit this solution, designed it into a new machine structure to bias and orient the pin properly, and ran full mechanical simulation to determine the alignment precision needed to ensure the contacts were valid at the maximum package tolerances.
To find out more about our HVM full kelvin solutions to 0.4mm pitch, please checkout the applications note.